|
NO. |
Form |
Description |
|
1 |
Number of layers |
1-12 Floors |
|
2 |
Maximum board size |
520×620、20.5×24.5 |
|
3 |
The thinnest, thickest plate thickness |
Double sided: 0.20-3.0mm; 4 layers: 0.40-4.0mm; 6 layers: 0. 80---5.0mm; |
|
4 |
Minimum line width |
4mil / 0.1mm |
|
5 |
Minimum line spacing |
4mil / 0.1mm |
|
6 |
Minimum aperture |
8mil / 0.2mm |
|
7 |
Minimum pad |
0.40mm/16mil |
|
8 |
Minimum hole copper thickness |
0.02mm |
|
9 |
Metallized hole tolerance |
±0.075mm/3mil |
|
10 |
Non-metallized hole tolerance |
±0.05mm/2mil |
|
11 |
Shape tolerance |
±0.10/4mil |
|
12 |
Warpage |
≤0.75% |
|
13 |
Hole tolerance |
±0.05mm/2mil |
|
14 |
Minimum solder ring |
0.10mm/4mil |
|
15 |
Insulation |
10 12 ohm normalcy |
|
16 |
Via resistance |
<300 normalcy |
|
17 |
Dielectric strength |
>1.3kv/mm |
|
18 |
Current shock |
10A |
|
19 |
Peel strength |
>4N |
|
20 |
Solder mask Abrasion |
1.5N/mm |
|
21 |
Thermal shock |
288℃、10seconds、thrice |
|
22 |
Fire-proof level |
94V-0 |
|
23 |
Test voltage |
50-300V |
